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- Acetylacetone peroxide
- Benzoyl peroxide (BPO)
- Cumene Hydroperoxide (CHP)
- Cumyl peroxyneodecanoate
- Cyclohexanone peroxide
- Di(2,4-dichlorobenzoyl) peroxide
- Dibutyl peroxydicarbonate
- Dicumyl peroxide (DCP)
- Dihexadecyl peroxydicarbonate
- Diisobutyryl peroxide
- Diisopropyl peroxydicarbonate (BIPB)
- Diisopropylbenzene hydroperoxide
- Dilauroyl Peroxide (DLP)
- Di-tert-butyl peroxide (DTBP)
- Ditetradecyl peroxydicarbonate
- Methyl Ethyl Ketone Peroxide (MEKP)
- Methyl isobutyl ketone peroxide
- Pivalate Peroxypivalate
- Tert-Butyl Cumene Peroxide
- Tert-Butyl Perbenzoate (TBPB)
- Tert-Butyl Peroxy-2-Ethylhexanoate (TBPEH or TBEC)
- Tert-Butyl Peroxyacetate (TBPA)
- Tert-Butyl Peroxyisobutyrate
- Tert-Butyl Peroxypivalate (TBPPI)
- Tert-Butylperoxy-3,5,5-trimethylhexanoate (TBPIN)
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- Aromatics Production Catalyst
- Toluene Production Catalyst
- Methanol Synthesis Catalyst
- Formaldehyde & DME Synthesis
- Propylene Oxide Catalyst
- Ethylene Oxide Catalyst
- Sulfuric Acid Catalyst
- Ammonia Synthesis Catalyst
- Polyethylene Catalyst
- Polypropylene Catalyst
- Isomerization Catalyst
- Hydrogenation/Dehydrogenation
- Reforming
- Alkylation
- Tail Gas Treating Catalyst
- PET/PTA Catalyst
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Products
Products
Products
HPCTP
- Product Description
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- Commodity name: HPCTP
Polycarbonate (PC) and PC/ABS Blends: HPCTP is effective in achieving UL94 V-0 flame retardancy ratings in these materials, often at loadings of 12-15 wt%. It can also improve the oxygen index (a measure of flammability) of PC/ABS to around 33%. Epoxy Resins: HPCTP is used as a flame retardant in epoxy resins, including those used in copper-clad laminates and other electronic applications.

Chemical Name:HPCTP
Shape: White crystalline powder
Component:2.2.4.4.6.6-hexaphenoxy-1.3.5-triaza-2λ5 ,4λ5 , 6λ5 -triphosphacyclohexa-1.3.5-triene
Other names:Phenoxycyclotriphosphazene, Cyclo-tris(diphenoxyphosphonitrile)
Molecular Formula: C36H30N3O6P3
Molecular Weight: 693.56
CAS Number: 1184-10-7
Application:
Polycarbonate (PC) and PC/ABS Blends: HPCTP is effective in achieving UL94 V-0 flame retardancy ratings in these materials, often at loadings of 12-15 wt%. It can also improve the oxygen index (a measure of flammability) of PC/ABS to around 33%.
Epoxy Resins: HPCTP is used as a flame retardant in epoxy resins, including those used in copper-clad laminates and other electronic applications.
LED Applications: HPCTP is suitable for use in both transparent and colored LED applications due to its effectiveness in PC and PC/ABS blends.
Copper-Clad Laminates: HPCTP can be incorporated into copper-clad laminates to enhance their flame-retardant properties, particularly in high-Tg (glass transition temperature) laminates.
Electronic Components: HPCTP is used in materials like EMC for IC packaging and other electronic components where flame retardancy is crucial.
Other Applications: HPCTP can also be found in powder coatings, encapsulating materials, and other polymer materials.
Halogen-free: HPCTP is a halogen-free flame retardant, addressing environmental concerns associated with halogenated flame retardants.
Synergistic Effect: It's known for its synergistic effect with nitrogen, enhancing flame retardancy.
Good Compatibility: HPCTP generally has good compatibility with various polymer substrates.
Performance: It can provide a good balance between flame retardancy and impact resistance in final products.
Packing:
5 kg Foil bags Nitrogen flushed, moisture-proof
25 kg PE drums
Storage:
Temperature Requirements: Short-term: <30°C (86°F), Long-term storage: 15-25°C (59-77°F), Freezing: Prohibited (causes crystallization issues)
Maintain relative humidity <45%
Keywords: HPCTP
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